Advanced Dicing Technologies (Israel)
Products : Advanced Dicing Saw & Peripheral Equipment
Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon- based, Package Singulation and hard material Microelectronic Components (MEC).
Application
Package Singulation
: BGA Package, QFN Package, LTCC, LED Package
Semiconductor Dicing
: Silicon Wafer and Discrete, LED GaAs
Microelectronic Components(MEC)
: Ceramic(Alumina), Multi Layer Ceramic Capacitor, Glass, PZT, PCB, Saw Devices
Features
Large dicing area up to 24” X 18”
2” and 4” configuration
Customization chucks, tape / tapeless process
Fully Automatic Twin system for high throughputs
The only Fully Automatic Twin that can handle shrinkage
Friendly and intuitive user interface (NUI)
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[ 8030 ] -
[ Twin system ] -
[ Peripheral system ] -
[ Blades ]
Website