scia Systems GmbH (Germany)
Product : scia Trim 200
Precise surface correction by Ion Beam Trimming (IBT)
Applications
Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
Film thickness error or step height correction in thin film head (TFH) manufacturing
Dimensional correction of MEMS structures
Features
Significant yield improvement
Film thickness homogeneity to be adjusted down to atom level of 0.1 nm
No edge exclusion with electrostatic chuck
Sub-nanometer removal with zero base etch function
Processing of film and wafer materials without restrictions
Throughput and maintenance optimized design for low production costs
Processing of wafers with photoresist masks due to good wafer cooling
Principle
Focused broad ion beam scans across wafer surface in vertical setup for low contamination
Local material removal is controlled by adjusting the dwell time
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[ scia Trim 200 ]
Product : scia Mill 150
Full surface Ion Beam Etching (IBE)
Applications
Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
Milling of metals in MEMS production (Au, Ru, Ta, …)
Milling of multilayers from diversified metal and dielectric materials
RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
Production of 3-dimensional optoelectronic microstructures
Ion beam smoothing for reduction of microroughness
Pattern transfer for optical gratings
Features
Etching angle adjustment with tiltable and rotatable substrate holder
Excellent uniformity without shaper
Enhanced selectivity and rate with reactive gases
Process control with exact SIMS based or optical end point detection
Carrier concept for adaptation to variable substrate sizes
Processing of wafers with photoresist masks due to good wafer cooling
Principle
Circular ion beam source etches full substrate area under a defined angle with inert or reactive gases
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[ scia Mill 150 ]
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