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JIACO Instruments B.V. (Netherland)
Products
JIACO Instruments manufactures leading-edge atmospheric pressure Microwave Induced Plasma (MIP) de-capsulation systems used in failure analysis and reliability testing of packaged Integrated Circuits.
Application
Wire Bond ; Ag, Cu, PCC, Al
Flipchip ; RD L, Cu Pillar, Solder Bump, FiFoWLP
SiP, SoC, 2.5D, 3D, CoWoS
Encapsulation ; High Tg, Underfill, DAF, Clear Mold
Failure Analysis ; No Contamination, Corrosion, Migration, EOS
Features
Provides fully automated Acid-free ATM O2 plasma etching.
Guarantees ultra-high quality selectivity.
Clean & Safe. Kinder to the Environment.
No damage to Si, Metal, Oxide, Passivation.
Applicable to all Microchip, Automotive, Defense, Aerospace.
Proven capabilities on the most challenging and advanced package failure analysis.
MIP increases throughput and efficiency in a lab by removing manual handling steps.
  • [ Microwave Induced Plasma ]
  • [ MIP _ e-WLB with RDL ]
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