JIACO Instruments B.V. (Netherland)
Products
JIACO Instruments manufactures leading-edge atmospheric pressure Microwave Induced Plasma (MIP) de-capsulation systems used in failure analysis and reliability testing of packaged Integrated Circuits.
Application
Wire Bond ; Ag, Cu, PCC, Al
Flipchip ; RD L, Cu Pillar, Solder Bump, FiFoWLP
SiP, SoC, 2.5D, 3D, CoWoS
Encapsulation ; High Tg, Underfill, DAF, Clear Mold
Failure Analysis ; No Contamination, Corrosion, Migration, EOS
Features
Provides fully automated Acid-free ATM O2 plasma etching.
Guarantees ultra-high quality selectivity.
Clean & Safe. Kinder to the Environment.
No damage to Si, Metal, Oxide, Passivation.
Applicable to all Microchip, Automotive, Defense, Aerospace.
Proven capabilities on the most challenging and advanced package failure analysis.
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