SET Corporation (France)
Products
High accuracy automated flip chip bonder
Application
Chip-to-chip, chip-to-wafer bonding
Advanced packaging, TSV, 3D interconnect
Chip stacking, optoelectronic and photonic, RF, MOEMS, MEMS, MCM
Features
Bonding accuracy ±0.5um, 3σ
Advanced laser leveling system
Face up station
Fluid dispenser
Integrated chamber for gang reflow in a gas or vaccuum environment
Gas confinement chamber for in-situ oxidation removal during bonding
Cognex for patter recognition system
Mass reflow, in-situ reflow, fluxless eutectic bonding
Thermo-compression, ultrasonic bonding
UV or thermal cured adhesive bonding
UV-NIL and hot embossing lithography
Force : 5N up to 4,000N
Temperature range : RT 450°C, resolution 1°C
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[ FC300 ]
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