Bruker Corporation (Hysitron, USA)
Products
Nanomechanical test instrument
Application
Young's modulus, hardness, fracture toughness test
Quantify scratch resistance, critical de-lamination forces, friction coefficient test
Semiconductor, data storage, MEMS, polymer, composite material
Features
-
[ TI980 Tribolndenter ]
In-situ SPM imaging as standard
Advanced control module with DSP technology
Dual head testing capability for nano / micro scale connectivity
26x faster feedback for superior control
Force sensitivity with <30nN noise floor for unprecedented accuracy
Active vibration isolation system
Integrated temperature / humidity sensor
All-digital color optics interfaced with a 1394-IEEE cable
Features
-
[ ATI-8800 ]
Light Curtain Universally Required Components:
2 Load Port Modules
2 FOUP openers
Robot arm (3 or 4 axis flexibility) 3 axis immediate requirement
200/300 mm wafer handling capabilities
Backside vacuum end effector
Pre-aligner Fab-specific Optional Components
Edge grip, flipper, Bernoulli end effectors
Cassette Mapping: Through Beam or reflective type optional
FFU
Optical Characterization
Products: Picoindenter
Nanomechanical Instrumentation for SEM, TEM & XRM
Application
Nanoindentation, Compression, Bend, Tension, Fatigue, Tribology
- TSV, Quality control & Failure analysis in Semiconductor
- Device Stiffness & Failure analysis in MEMS
- Thin film, Polymer, DLC, CMT & Low K dielectrics for materials
-
[ Nanoindentation ] -
[ Compression ] -
[ Bend ] -
[ Tension ]
Features
Advanced instrument for quantitative nanomechanical testing in the SEM
One-to-one correlation between load-displacement data and SEM imaging
Small-volume picoindenter system in the SEM
Compact system designed to fit standard SEM and FIB/SEM chambers
Enables high tilt of the microscope stage for specimen imaging during testing
Compatible with most ThermoFisher, Hitachi, JEOL, TESCAN, Zeiss, and more …
Formal compatibility check with your SEM
Website
Nanomechanical Test instruments