MPI Corporation (Taiwan)
Products
A wide range of solutions to the semiconductor wafer level test market
Application
Semiconductor
Cantilever Probe Card
LCD Driver IC
- Multi DUT
- High pin count
- Fine Pitch
- 4 rows staggered gold bump layout
- Small bump size
- High speed and less cleaning
Logic IC
- Multi DUT
- Shelf probe card
- 2 X 2 DUT
- Fine Pitch
- 4 row staggered pad
- Small pad size
- High speed
Advanced Probe Card
Cobra
- Eutectic bump
- Lead free bump
- Copper pillar
- Capped pillar
- Aluminum pad
MEMS 3DS
- Copper pillar
- Small aluminum pad
iPC
- Multi DUT
- Independent adjustable lens mechanism
- High speed
HSPC
- Impedance matching probe structure
- Available for the speed up to Gbps level