Micro Point Pro Ltd. (Israel)
Products
Manual ball, wedge, dual wire bonder
Application
Ball & wedge wire bonding for LED, IC, microwave, MEMS, hybrid, MMC, discrete devices
Features
7" TFT touch screen management(Windows CE based management software)
USB connectivity - External mouse, keyboard, disk on key
Semi automatic/manual mode with Z option
Consistent ball size via negative electronic flame-off
Missing ball detection and auto-stop
800MB capacity
K&S bonding profiles internal library
Built-in temperature controller
Deep access capability
Various microscope and spotlight targeting options available
Large 6"x6" bonding are
Ball bonding, bumping, coining, security bond and tab
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[ IBOND5000-BALL WIRE BONDER ]
Website