3D-Micromac AG (Germany)
Products
Laser system for Semiconductor/Glass/uLED/MiniLED/SIC
microPRO ™ XS OCF – Omnic Contact Formation of SIC Power Devices
microPREP™ PRO - High-Throughput Laser-Based Sample Preparation
microCETI™ - LLO(Laser Lift Off) & LIFT(Laser induced Forward Trasfer) for uLED,miniLED
microSHAPE™ - Laser Systems for Cutting of Glass and Sapphire
microDICE™ – Wafer Dicing System for Separation of Silicon and Silicon Carbide Wafers
Customized/OEM Laser Systems for Micromachining Applications
Application
SIC, uLED, Mini Display, Glass & Sapphire, Sample Preparation
Features
Fully automated wafer/substrate handling option
SECS/GEM
ID reader for wafer and/or cassette
Easy capability of being automated
Straightforward process monitoring
Apply laser source depending on process and application
Automatic wafer alignment
Laser Safety class 1
Compatible with common SEMI /CE standards
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[ MicroPRO XS OCF ] -
[ microPREP ] -
[ microCETI ] -
[ microSHAPE ]
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