ERS Electronic GmbH (Germany)
Products for Debonding : ADM, WAT, MDM, MWAT
Application
Automatic/semi-automated eWLB wafer debonding
Automatic/semi-automated Warpage Adjustment
Features for ADM
eWLB optimized thermal debonding
Fully automatic detaping
eWLB wafer warpage control and inspection
eWLB wafer frontside marking
Fully auto “warpage adjust only” mode
MMI according to SEMI E95
SECS/GEM according to SEMI E005 and E030
Features for WAT
Fully automated wafer warpage adjustment
Large recipe storage
Optional oxygen free environment
MMI with touch screen
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[ ADM330 ] -
[ WAT330 ]
Products for Thermal Chucks : AirCool® , AirCool® PRIME, AC3
Application
All major production/analytical probers
Customer-specific equipment solutions
Full hardware and software integrations available
Space-saving chiller dimensions
No separate purge air source required
Features for AirCool®
No liquids or Peltier elements
MTBF>50,000 hours
-10°C (200mm), 0°C (300mm) to 300°C
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[ AirCool® ]
Features for AirCool® PRIME
Industry’s lowest soaking time
Ultra low noise
Fast transition times
PRIME Thermo Shield
Highest flexibility with modular surface design
-65°C to 300°C
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[ AirCool® PRIME ]
Features for AC3
No liquid or Peltier elements
MTBH >50,000hours
-55 to +400℃
Modular system, adaptable to individual testing requiremens
High energy dissipation option with patented PowerSense® upgrade
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[ AC3 ]
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