3D-Micromac AG (Germany)
Products
microCELL™ OTF
microCELL™ TLS
microFLEX™
microPRO TMS
Application
Laser Contact Opening
Half-Cell / shingled cells Cutting
Features
Cells cut with TLS process have better electrical characteristics compared to scribe and break process
- Lower power loss of cell
- No shunts at cutting edge
- Reduction of parallel resistance is lower
- No increase in leakage current
- Less recombination in edge zone after complementary passivation process
- Expected half-cell module power increase 1-2 W (depending on cell type)
- > 6,000 wph for 1/2 to 1/6 cut cells
- Max. wafer size up to M12
microCELL™ OTF for Laser Contact Opening
- Low operating costs
- Highest availability
- Laser processing on-the-fly
- Innovative handling concept enable maximum throughput and yield in the mass production
- Contactless cell handling enables processing without surface defects and microcracks
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[ < microCELL OTF > High-Throughput Laser Processing System for PERC Cells (LCO) ] -
[ < microPRO TMS >TLS-Dicing ]
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